US 12,407,349 B2
Fused metal nanostructured networks, fusing solutions with reducing agents and methods for forming metal networks
Ajay Virkar, San Mateo, CA (US); Xiqiang Yang, Hayward, CA (US); Ying-Syi Li, Fremont, CA (US); Dennis McKean, Milpitas, CA (US); and Melburne C. LeMieux, San Jose, CA (US)
Assigned to EKC Technology, Inc., Hayward, CA (US)
Filed by EKC Technology, Inc., Hayward, CA (US)
Filed on Jun. 6, 2018, as Appl. No. 16/001,472.
Application 16/001,472 is a division of application No. 13/777,802, filed on Feb. 26, 2013, granted, now 10,020,807.
Prior Publication US 2018/0287608 A1, Oct. 4, 2018
Int. Cl. H05K 3/00 (2006.01); B32B 15/02 (2006.01); B32B 15/08 (2006.01); B32B 15/18 (2006.01); B32B 27/28 (2006.01); B32B 27/30 (2006.01); B32B 27/32 (2006.01); B32B 27/34 (2006.01); B32B 27/36 (2006.01); B32B 27/40 (2006.01); C09D 11/52 (2014.01); G06F 3/044 (2006.01); H03K 17/96 (2006.01); H05K 1/09 (2006.01); H05K 3/02 (2006.01); H05K 3/06 (2006.01); H05K 3/12 (2006.01)
CPC H03K 17/9622 (2013.01) [B32B 15/02 (2013.01); B32B 15/08 (2013.01); B32B 15/18 (2013.01); B32B 27/281 (2013.01); B32B 27/286 (2013.01); B32B 27/288 (2013.01); B32B 27/304 (2013.01); B32B 27/306 (2013.01); B32B 27/308 (2013.01); B32B 27/32 (2013.01); B32B 27/34 (2013.01); B32B 27/36 (2013.01); B32B 27/40 (2013.01); C09D 11/52 (2013.01); G06F 3/044 (2013.01); H05K 1/097 (2013.01); B32B 2270/00 (2013.01); B32B 2307/202 (2013.01); B32B 2307/412 (2013.01); B32B 2457/00 (2013.01); G06F 2203/04103 (2013.01); G06F 2203/04112 (2013.01); H03K 2217/96031 (2013.01); H05K 3/027 (2013.01); H05K 3/06 (2013.01); H05K 3/1283 (2013.01); H05K 2201/0108 (2013.01); H05K 2201/026 (2013.01); H05K 2203/107 (2013.01); H05K 2203/1131 (2013.01); H05K 2203/1157 (2013.01); H05K 2203/125 (2013.01); Y10T 428/12424 (2015.01); Y10T 428/12444 (2015.01); Y10T 442/655 (2015.04)] 20 Claims
OG exemplary drawing
 
1. A method for forming a fused metal nanostructured network, the method comprising:
contacting metal nanowires with a fusing solution comprising a solvent, a reducing agent and a metal ion source, wherein the metal ion source comprises metal ions from a dissolved salt or an oxidizing acid that forms metal ions from the metal nanowires, wherein the contacting comprises 1) combining the metal nanowires and the fusing solution into a single solution and coating the single solution onto a surface or 2) forming a coating of metal nanowires on a surface and depositing a quantity of fusing solution onto the surface coated with metal nanowires and wherein the metal ion source comprises a metal salt or an oxidizing acid at a pH from about 1.5 to about 5; and
with the metal nanowires coated on the surface, concentrating the fusing solution by removing at least partially the solvent of the fusing solution to effect the reduction of metal ions to their corresponding metal element to fuse the metal nanowires together to form the fused metal nanostructured network, wherein the fused metal nanostructured network is supported on a substrate to form a structure comprising a film on a surface of the substrate and wherein the film has a sheet resistance of no more than about 120 ohm/sq, and a total transmittance for visible light through the film of at least about 89%.