US 12,407,328 B2
Hybrid filter, multiplexer, radio-frequency module, and communication device
Syunsuke Kido, Kyoto (JP); Naru Morito, Kyoto (JP); Takanori Uejima, Kyoto (JP); Masanari Miura, Kyoto (JP); Yukiya Yamaguchi, Kyoto (JP); Takuma Kuroyanagi, Kyoto (JP); Tomomi Yasuda, Kyoto (JP); Masanori Kato, Kyoto (JP); and Yuuki Fukuda, Kyoto (JP)
Assigned to MURATA MANUFACTURING CO., LTD., Nagaokakyo (JP)
Filed by Murata Manufacturing Co., Ltd., Kyoto (JP)
Filed on Jun. 6, 2023, as Appl. No. 18/329,607.
Application 18/329,607 is a continuation of application No. PCT/JP2021/029237, filed on Aug. 5, 2021.
Claims priority of application No. 2020-206045 (JP), filed on Dec. 11, 2020; and application No. 2021-059093 (JP), filed on Mar. 31, 2021.
Prior Publication US 2023/0318573 A1, Oct. 5, 2023
Int. Cl. H03H 9/64 (2006.01)
CPC H03H 9/6406 (2013.01) 19 Claims
OG exemplary drawing
 
1. A hybrid filter comprising:
a substrate having a first major surface and a second major surface that are opposite to each other;
one or more acoustic wave resonator elements disposed at the substrate;
one or more first inductors disposed at the substrate; and
one or more first capacitors disposed at the substrate, wherein
a pass band width of the hybrid filter is wider than a resonance band width of the one or more acoustic wave resonator elements,
one of the one or more acoustic wave resonator elements, the one or more first inductors, and the one or more first capacitors is a first circuit element, and the first circuit element is disposed at the first major surface, and
another of the one or more acoustic wave resonator elements, the one or more first inductors, and the one or more first capacitors is a second circuit element, and the second circuit element is disposed at the second major surface, wherein
one of the one or more first inductors and the one or more first capacitors is formed inside the substrate.