US 12,407,323 B2
Vibrator device
Ryuta Nishizawa, Nagano (JP); and Junichi Takeuchi, Chino (JP)
Assigned to SEIKO EPSON CORPORATION, Tokyo (JP)
Filed by SEIKO EPSON CORPORATION, Tokyo (JP)
Filed on Jan. 30, 2024, as Appl. No. 18/427,344.
Claims priority of application No. 2023-012739 (JP), filed on Jan. 31, 2023.
Prior Publication US 2024/0258988 A1, Aug. 1, 2024
Int. Cl. H03H 9/05 (2006.01); H03B 5/04 (2006.01); H03B 5/32 (2006.01); H03H 9/02 (2006.01); H03H 9/19 (2006.01)
CPC H03H 9/0547 (2013.01) [H03B 5/04 (2013.01); H03B 5/32 (2013.01); H03H 9/02102 (2013.01); H03H 9/19 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A vibrator device comprising:
a base including a semiconductor substrate that has a first surface and a second surface in a front and back relationship with the first surface and that has an integrated circuit disposed at the first surface;
a vibration element electrically coupled to the integrated circuit; and
a lid provided with a recess for accommodating the vibration element, including a side wall around the recess, and having an end surface of the side wall bonded to the first surface at a bonding portion, wherein
the integrated circuit includes a first circuit,
the first circuit includes a first circuit element disposed in a first region of the first surface, the first region overlapping the bonding portion in a plan view orthogonal to the first surface,
the first circuit element is a passive element or a transistor,
θ<90°, θ being an angle formed by the first surface and an inner side surface of the side wall,
the integrated circuit includes a second circuit,
the first surface includes a second region,
the first region surrounds the second region in a plan view orthogonal to the first surface, and
the second circuit includes a second circuit element disposed in the second region.