US 12,407,315 B2
Stacked filter package having multiple types of acoustic wave devices
Atsushi Takano, Kadoma (JP); Mitsuhiro Furukawa, Nishinomiya (JP); and Takeshi Furusawa, Toyonaka (JP)
Assigned to Skyworks Solutions, Inc., Irvine, CA (US)
Filed by Skyworks Solutions, Inc., Irvine, CA (US)
Filed on Nov. 7, 2022, as Appl. No. 18/053,313.
Claims priority of provisional application 63/276,929, filed on Nov. 8, 2021.
Prior Publication US 2023/0142089 A1, May 11, 2023
Int. Cl. H03H 3/02 (2006.01); H03H 3/007 (2006.01); H03H 3/08 (2006.01); H03H 9/25 (2006.01); H03H 9/58 (2006.01); H03H 9/64 (2006.01)
CPC H03H 3/02 (2013.01) [H03H 3/08 (2013.01); H03H 9/25 (2013.01); H03H 9/585 (2013.01); H03H 9/586 (2013.01); H03H 9/6426 (2013.01); H03H 9/6489 (2013.01); H03H 2003/0071 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A stacked filter package comprising:
a first acoustic wave device having a first device type, the first acoustic wave device including a first substrate having an isotropic thermal expansion characteristic and a first coefficient of thermal expansion;
a second acoustic wave device having a second device type different from the first device type, the second acoustic wave device including a second substrate having an anisotropic thermal expansion characteristic and a second coefficient of thermal expansion, the second coefficient of thermal expansion being at least double the first coefficient of thermal expansion; and
a bonding structure between the first and second substrates, the bonding structure coupling the first and second substrates.