US 12,406,986 B2
Particle, electrode, power storage device, electronic device, and method for manufacturing electrode
Takahiro Kawakami, Kanagawa (JP); Teruaki Ochiai, Kanagawa (JP); Shuhei Yoshitomi, Kanagawa (JP); Takuya Hirohashi, Kanagawa (JP); Mako Motoyoshi, Kanagawa (JP); Yohei Momma, Kanagawa (JP); and Junya Goto, Kanagawa (JP)
Assigned to Semiconductor Energy Laboratory Co., Ltd., Kanagawa-ken (JP)
Filed by SEMICONDUCTOR ENERGY LABORATORY CO., LTD., Atsugi (JP)
Filed on Jun. 21, 2023, as Appl. No. 18/212,440.
Application 16/114,312 is a division of application No. 14/920,650, filed on Oct. 22, 2015, granted, now 10,084,186, issued on Sep. 25, 2018.
Application 18/212,440 is a continuation of application No. 17/852,407, filed on Jun. 29, 2022, granted, now 11,710,823.
Application 17/852,407 is a continuation of application No. 16/934,201, filed on Jul. 21, 2020, granted, now 11,394,025, issued on Jul. 19, 2022.
Application 16/934,201 is a continuation of application No. 16/114,312, filed on Aug. 28, 2018, granted, now 10,749,174, issued on Aug. 18, 2020.
Claims priority of application No. 2014-218501 (JP), filed on Oct. 27, 2014; application No. 2014-218659 (JP), filed on Oct. 27, 2014; application No. 2014-227325 (JP), filed on Nov. 7, 2014; and application No. 2014-227729 (JP), filed on Nov. 10, 2014.
Prior Publication US 2023/0361290 A1, Nov. 9, 2023
Int. Cl. H01M 4/505 (2010.01); H01M 4/131 (2010.01); H01M 4/1391 (2010.01); H01M 4/36 (2006.01)
CPC H01M 4/505 (2013.01) [H01M 4/131 (2013.01); H01M 4/1391 (2013.01); H01M 4/366 (2013.01); H01M 2220/30 (2013.01)] 11 Claims
OG exemplary drawing
 
1. A method for manufacturing an electrode layer, comprising:
mixing a particle, a binder, and a solvent to form a mixture;
forming the mixture over a current collector to form a mixed layer; and
performing heat treatment on the mixed layer to form the electrode layer at a temperature higher than or equal to 160° C. and lower than or equal to 400° C. in a nitrogen or rare gas atmosphere,
wherein the particle after the heat treatment comprises a first region and a second region,
wherein the second region is located at a more surface side than the first region,
wherein the second region has a spinel structure,
wherein the first region and the second region comprises lithium, manganese, an element M, and oxygen,
wherein a thickness of the second region is greater than or equal to 0.1 nm and less than or equal to 30 nm,
wherein the element represented by M is one or more elements selected from Cr, Ni, Ga, Fe, Mo, In, Nb, Co, Mg, Al, Ti, Cu, Zn, Si, and P, and
wherein the electrode layer comprises a compound having a bond between at least one element selected from lithium, manganese, the element M, and oxygen and at least one element in the binder.