US 12,406,975 B2
Techniques for processing devices
Cyprian Emeka Uzoh, San Jose, CA (US); Laura Wills Mirkarimi, Sunol, CA (US); Guilian Gao, Campbell, CA (US); and Gaius Gillman Fountain, Jr., Youngsville, NC (US)
Assigned to ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC., San Jose, CA (US)
Filed by ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC., San Jose, CA (US)
Filed on Dec. 15, 2023, as Appl. No. 18/541,869.
Application 18/541,869 is a continuation of application No. 17/344,100, filed on Jun. 10, 2021, granted, now 11,855,064.
Application 17/344,100 is a continuation of application No. 16/919,989, filed on Jul. 2, 2020, granted, now 11,037,919, issued on Jun. 15, 2021.
Application 16/919,989 is a continuation of application No. 16/262,489, filed on Jan. 30, 2019, granted, now 10,727,219, issued on Jul. 28, 2020.
Claims priority of provisional application 62/631,216, filed on Feb. 15, 2018.
Prior Publication US 2024/0371850 A1, Nov. 7, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 25/00 (2006.01); H01L 21/18 (2006.01); H01L 21/683 (2006.01); H01L 21/78 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2023.01)
CPC H01L 25/50 (2013.01) [H01L 21/187 (2013.01); H01L 21/6836 (2013.01); H01L 21/78 (2013.01); H01L 24/27 (2013.01); H01L 24/30 (2013.01); H01L 24/83 (2013.01); H01L 25/0657 (2013.01); H01L 2224/83011 (2013.01); H01L 2224/83013 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A bonded structure comprising:
a substrate directly hybrid bonded to a die along a bonding interface without an intervening adhesive, the die having a smaller footprint than a footprint of the substrate,
wherein the substrate comprises one or more metal features, wherein the die comprises one or more metal features, and wherein the one or more metal features of the substrate are directly bonded to the one more metal features of the die at the bond interface,
wherein one of the die and the substrate comprises a characteristic profile of having been activated with an activating species prior to bonding, and the other of the die and the substrate lacks the characteristic profile of having been activated with the activating species prior to bonding.