US 12,406,965 B2
Package
Ming-Fa Chen, Taichung (TW); Chao-Wen Shih, Hsinchu County (TW); Hsien-Wei Chen, Hsinchu (TW); Sung-Feng Yeh, Taipei (TW); and Tzuan-Horng Liu, Taoyuan (TW)
Assigned to Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed on Jun. 24, 2024, as Appl. No. 18/751,359.
Application 17/344,928 is a division of application No. 16/572,622, filed on Sep. 17, 2019, granted, now 11,063,022, issued on Jul. 13, 2021.
Application 18/751,359 is a continuation of application No. 17/344,928, filed on Jun. 10, 2021, granted, now 12,046,579.
Prior Publication US 2024/0347512 A1, Oct. 17, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 25/065 (2023.01); H01L 21/304 (2006.01); H01L 21/56 (2006.01); H01L 21/683 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/538 (2006.01); H01L 23/544 (2006.01); H10D 86/01 (2025.01)
CPC H01L 25/0657 (2013.01) [H01L 21/304 (2013.01); H01L 21/56 (2013.01); H01L 23/3157 (2013.01); H01L 23/5384 (2013.01); H01L 23/544 (2013.01); H01L 24/05 (2013.01); H01L 21/6835 (2013.01); H01L 2224/0231 (2013.01); H01L 2224/02372 (2013.01); H01L 2224/80203 (2013.01); H01L 2224/8084 (2013.01); H01L 2225/06541 (2013.01); H10D 86/0214 (2025.01)] 20 Claims
OG exemplary drawing
 
1. A package, comprising:
a carrier substrate; and
a first die and a second die stacked on the carrier substrate in sequential order, wherein the first die comprises a first bonding layer, a second bonding layer, and an alignment mark embedded in the first bonding layer, the second die comprises a third bonding layer, a surface of the first bonding layer form a rear surface of the first die, a surface of the second bonding layer form an active surface of the first die, the rear surface of the first die is in physical contact with the carrier substrate, and the active surface of the first die is in physical contact with the third bonding layer of the second die.