US 12,406,963 B2
Wafer level integration of transducer elements, techniques and implementations
Yaniv Maydar, Tel Aviv (IL); Gil Peshes, Kidron (IL); and Michael Kedem, Ashdod (IL)
Assigned to ELTA SYSTEMS LTD., Ashdod (IL)
Appl. No. 18/003,364
Filed by ELTA SYSTEMS LTD., Ashdod (IL)
PCT Filed Jun. 29, 2021, PCT No. PCT/IL2021/050794
§ 371(c)(1), (2) Date Dec. 27, 2022,
PCT Pub. No. WO2022/003681, PCT Pub. Date Jan. 6, 2022.
Claims priority of application No. 275736 (IL), filed on Jun. 29, 2020.
Prior Publication US 2023/0317679 A1, Oct. 5, 2023
Int. Cl. H01L 25/065 (2023.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/538 (2006.01); H01L 25/00 (2006.01)
CPC H01L 25/0655 (2013.01) [H01L 23/3128 (2013.01); H01L 23/5384 (2013.01); H01L 23/5385 (2013.01); H01L 24/96 (2013.01); H01L 25/50 (2013.01); H01L 2224/96 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An integrated circuit assembly having a top side and a bottom side, the integrated circuit assembly comprising:
a base structure comprising:
an interposer board; and
a plurality of interfacing dies electrically coupled to said interposer board; and
a cap structure comprising:
an intermediating board; and
a panel of active elements, forming a top side of said integrated circuit assembly and having a plurality of active elements electrically coupled to said intermediating board;
wherein said cap structure is attached to said base structure such that each one of said plurality of active elements is electrically coupled to at least one of said plurality of interfacing dies.