US 12,406,961 B2
Integrated circuit package and method
Chung-Shi Liu, Hsinchu (TW); Mao-Yen Chang, Kaohsiung (TW); Yu-Chia Lai, Zhunan Township (TW); Kuo-Lung Pan, Hsinchu (TW); Hao-Yi Tsai, Hsinchu (TW); Ching-Hua Hsieh, Hsinchu (TW); Hsiu-Jen Lin, Zhubei (TW); Po-Yuan Teng, Hsinchu (TW); Cheng-Chieh Wu, Hsinchu (TW); and Jen-Chun Liao, Taoyuan (TW)
Assigned to Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu (TW)
Filed on Jan. 5, 2023, as Appl. No. 18/150,240.
Claims priority of provisional application 63/377,972, filed on Sep. 30, 2022.
Prior Publication US 2024/0113071 A1, Apr. 4, 2024
Int. Cl. H01L 23/00 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01L 23/40 (2006.01); H01L 25/18 (2023.01); H10B 80/00 (2023.01)
CPC H01L 24/95 (2013.01) [H01L 21/563 (2013.01); H01L 23/3185 (2013.01); H01L 23/4012 (2013.01); H01L 24/16 (2013.01); H01L 24/19 (2013.01); H01L 24/20 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 24/83 (2013.01); H01L 25/18 (2013.01); H10B 80/00 (2023.02); H01L 2023/4081 (2013.01); H01L 2023/4087 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/19 (2013.01); H01L 2224/211 (2013.01); H01L 2224/215 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/83007 (2013.01); H01L 2224/83939 (2013.01); H01L 2224/95 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01022 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01074 (2013.01); H01L 2924/3512 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A device comprising:
integrated circuit dies;
an encapsulant around the integrated circuit dies;
a redistribution structure on the encapsulant, the redistribution structure comprising redistribution lines and a first metal pad, the redistribution lines and the first metal pad connected to the integrated circuit dies;
a first metal line disposed on the redistribution structure, wherein the first metal line is electrically floating;
a first electrical component connected to the first metal pad; and
an underfill between the first electrical component and the redistribution structure, wherein the underfill is around the first metal pad, and wherein a first opening in the underfill exposes a top surface of the first metal line.