US 12,406,936 B2
Semiconductor package with substrate recess and methods for forming the same
Ming-Chih Yew, Hsinchu (TW); Shu-Shen Yeh, Taoyuan (TW); Yu-Sheng Lin, Zhubei (TW); Po-Yao Lin, Zhudong Township (TW); and Shin-Puu Jeng, Po-Shan Village (TW)
Assigned to Taiwan Semiconductor Manufacturing Company Limited, Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Company Limited, Hsinchu (TW)
Filed on Jun. 1, 2022, as Appl. No. 17/829,552.
Prior Publication US 2023/0395519 A1, Dec. 7, 2023
Int. Cl. H01L 23/538 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01); H01L 25/00 (2006.01); H01L 25/18 (2023.01); H01L 23/00 (2006.01)
CPC H01L 23/5389 (2013.01) [H01L 23/3121 (2013.01); H01L 23/49811 (2013.01); H01L 23/5383 (2013.01); H01L 23/5385 (2013.01); H01L 23/5386 (2013.01); H01L 25/18 (2013.01); H01L 25/50 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/13155 (2013.01); H01L 2224/16227 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A semiconductor package, comprising:
an interposer;
at least one semiconductor integrated circuit (IC) die mounted over a first side surface of the interposer;
a semiconductor device mounted over a second side surface of the interposer that is opposite the first side surface of the interposer; and
a package substrate comprising a recess in a front side surface of the package substrate and at least one channel in a bottom surface of the recess, the second side surface of the interposer bonded to the front side surface of the package substrate such that the semiconductor device overlies the recess and the at least one channel in the front side surface of the package substrate and the semiconductor device is spaced from the at least one channel.