US 12,406,921 B2
Electronic device
Jung Jui Kang, Kaohsiung (TW); and Chang Chi Lee, Kaohsiung (TW)
Assigned to ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaohsiung (TW)
Filed by Advanced Semiconductor Engineering, Inc., Kaohsiung (TW)
Filed on Jul. 21, 2022, as Appl. No. 17/870,676.
Prior Publication US 2024/0030125 A1, Jan. 25, 2024
Int. Cl. H01L 23/522 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01); H01L 23/50 (2006.01); H01L 23/528 (2006.01)
CPC H01L 23/5226 (2013.01) [H01L 23/3128 (2013.01); H01L 23/49816 (2013.01); H01L 23/50 (2013.01); H01L 23/5286 (2013.01); H01L 24/13 (2013.01); H01L 24/19 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/18 (2013.01)] 19 Claims
OG exemplary drawing
 
1. An electronic device, comprising:
a first circuit structure;
a first die disposed below the first circuit structure;
a second die disposed below the first circuit structure; and
a third die disposed above the first circuit structure and electrically connecting the first die to the second die,
wherein the first die communicates with the second die through the third die,
wherein the first die includes an active surface facing the first circuit structure and a backside surface opposite to the active surface of the first die, wherein the first die is configured to receive a power through the backside surface thereof.