US 12,406,917 B2
Semiconductor package and method of manufacturing the semiconductor package
Geunwoo Kim, Asan-si (KR); Jiwon Shin, Daejeon (KR); Donguk Kwon, Asan-si (KR); Wooram Myung, Suwon-si (KR); and Kwangbok Woo, Cheonan-si (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed on May 9, 2022, as Appl. No. 17/739,329.
Claims priority of application No. 10-2021-0124814 (KR), filed on Sep. 17, 2021.
Prior Publication US 2023/0091131 A1, Mar. 23, 2023
Int. Cl. H01L 23/498 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01)
CPC H01L 23/49838 (2013.01) [H01L 21/4857 (2013.01); H01L 21/486 (2013.01); H01L 23/49816 (2013.01); H01L 23/49822 (2013.01); H01L 23/49894 (2013.01); H01L 24/16 (2013.01); H01L 24/17 (2013.01); H01L 24/81 (2013.01); H01L 2224/16111 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/16237 (2013.01); H01L 2224/17104 (2013.01); H01L 2224/17517 (2013.01); H01L 2224/81224 (2013.01); H01L 2224/81815 (2013.01); H01L 2924/3511 (2013.01); H01L 2924/37001 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A semiconductor package, comprising:
a mounting substrate including a substrate having an upper surface and a lower surface opposite to each other and including wirings provided respectively in a plurality of insulation layers, first substrate pads and second substrate pads on the upper surface arranged in a chip mounting region, heat absorbing pads, configured to absorb heat, on the upper surface arranged in a peripheral region surrounding the chip mounting region, and connection lines comprising conductive material and configured to transfer heat from the heat absorbing pads to the second substrate pads;
a semiconductor chip disposed within the chip mounting region of the mounting substrate; and
first and second bumps interposed between the semiconductor chip and the mounting substrate, the first and second bumps being bonded to the first and second substrate pads respectively,
wherein the second bump is thermally connected to the heat absorbing pad by the connection line and the second substrate pad.