US 12,406,911 B2
Semiconductor device with embedded battery and method therefor
Stephen Ryan Hooper, Queen Creek, AZ (US); Chanon Suwankasab, Pathumthani (TH); Chayathorn Saklang, Bangplee (TH); Crispulo Estira Lictao, Jr., Binan (PH); Amornthep Saiyajitara, Bangken (TH); and Dominic (Pohmeng) Koey, Shah Alam (MY)
Assigned to NXP USA, Inc., Austin, TX (US)
Filed by NXP USA, INC., Austin, TX (US)
Filed on Apr. 26, 2022, as Appl. No. 17/660,650.
Prior Publication US 2023/0343683 A1, Oct. 26, 2023
Int. Cl. H01L 23/495 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H02J 7/00 (2006.01)
CPC H01L 23/49575 (2013.01) [H01L 21/56 (2013.01); H01L 23/3107 (2013.01); H01L 23/49503 (2013.01); H01L 23/49593 (2013.01); H01L 24/48 (2013.01); H02J 7/0063 (2013.01); H01L 2224/48221 (2013.01)] 6 Claims
OG exemplary drawing
 
1. A packaged semiconductor device comprising:
a sensor system affixed to a die pad portion of a leadframe;
an embedded battery affixed to the leadframe such that a first terminal of the embedded battery is affixed to a first leg of the leadframe and a second terminal of the embedded battery affixed to a second leg of the leadframe; and
an encapsulant wholly encapsulating the sensor system, the embedded battery, and the leadframe such that no portion of the sensor system, the embedded battery, or the leadframe extends outside of the encapsulant.