US 12,406,910 B2
Packaging of a semiconductor device with a plurality of leads
Katsuhiro Iwai, Kyoto (JP)
Assigned to ROHM CO., LTD., Kyoto (JP)
Filed by ROHM CO., LTD., Kyoto (JP)
Filed on Jun. 25, 2024, as Appl. No. 18/753,892.
Application 18/753,892 is a continuation of application No. 18/301,807, filed on Apr. 17, 2023, granted, now 12,046,541.
Application 18/301,807 is a continuation of application No. 17/472,362, filed on Sep. 10, 2021, granted, now 11,658,100.
Application 17/472,362 is a continuation of application No. 17/109,675, filed on Dec. 2, 2020, granted, now 11,183,444.
Application 17/109,675 is a continuation of application No. 16/242,227, filed on Jan. 8, 2019, granted, now 10,886,203.
Application 16/242,227 is a continuation of application No. 15/416,261, filed on Jan. 26, 2017, granted, now 10,211,130.
Claims priority of application No. 2016-013368 (JP), filed on Jan. 27, 2016.
Prior Publication US 2024/0347426 A1, Oct. 17, 2024
Int. Cl. H01L 23/495 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01)
CPC H01L 23/49548 (2013.01) [H01L 23/3107 (2013.01); H01L 23/3121 (2013.01); H01L 23/3142 (2013.01); H01L 23/4952 (2013.01); H01L 23/49541 (2013.01); H01L 23/49551 (2013.01); H01L 23/49582 (2013.01); H01L 23/562 (2013.01); H01L 24/06 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 24/49 (2013.01); H01L 24/73 (2013.01); H01L 2224/04026 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/0603 (2013.01); H01L 2224/06181 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/48465 (2013.01); H01L 2224/49111 (2013.01); H01L 2224/49113 (2013.01); H01L 2224/49431 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/181 (2013.01); H01L 2924/18301 (2013.01); H01L 2924/3512 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A semiconductor device comprising:
a first lead;
a semiconductor element spaced apart from the first lead in a first direction in plan view and electrically connected to the first lead;
a second lead on which the semiconductor element is provided; and
a sealing resin covering the semiconductor element and a part of the first lead,
wherein the sealing resin comprises a first resin side surface extending in a second direction perpendicular to the first direction in plan view,
the first lead comprises a protrusion, a bottom-surface exposed portion, and an inner portion, the protrusion projecting out from the first resin side surface in the first direction, the inner portion being embedded within the sealing resin,
the bottom-surface exposed portion connects the protrusion and the inner portion to each other,
the inner portion of the first lead comprises a wire bonding part and a bent part, the bent part connecting the bottom-surface exposed portion and the wire bonding part to each other, and
in a cross section, the second lead is formed with an eave portion extending toward the first lead in the first direction, the eave portion including a curved surface at an upper side of the eave portion, the eave portion being formed in an area between an upper surface of the second lead and a lower surface of the second lead, and
the first lead is formed with openings each extending from an edge of the first lead to the inner portion of the first lead in plan view.