US 12,406,909 B2
Method of manufacturing semiconductor devices and corresponding semiconductor device
Riccardo Villa, Milan (IT); and Matteo De Santa, Lombardia (IT)
Assigned to STMicroelectronics S.r.l., Agrate Brianza (IT)
Filed by STMicroelectronics S.r.l., Agrate Brianza (IT)
Filed on Jun. 24, 2022, as Appl. No. 17/848,958.
Claims priority of application No. 102021000017207 (IT), filed on Jun. 30, 2021.
Prior Publication US 2023/0005826 A1, Jan. 5, 2023
Int. Cl. H01L 23/495 (2006.01); H01L 21/48 (2006.01)
CPC H01L 23/49548 (2013.01) [H01L 21/4825 (2013.01); H01L 23/49524 (2013.01)] 12 Claims
OG exemplary drawing
 
1. A method, comprising:
arranging at least one semiconductor chip over a substrate;
arranging a plurality of current-carrying formations coupled to the at least one semiconductor chip;
wherein the substrate does not include electrically conductive formations that electrically couple two or more current-carrying formations of the plurality of current-carrying formations to each other; and
forming at least one electrical contact between adjacent ones of the current-carrying formations in the plurality of current-carrying formations to provide a multi-formation current-carrying channel.