US 12,406,908 B2
Semiconductor module
Kohei Tanikawa, Kyoto (JP); and Kenji Hayashi, Kyoto (JP)
Assigned to ROHM CO., LTD., Kyoto (JP)
Appl. No. 18/012,207
Filed by ROHM CO., LTD., Kyoto (JP)
PCT Filed Sep. 15, 2021, PCT No. PCT/JP2021/033845
§ 371(c)(1), (2) Date Dec. 21, 2022,
PCT Pub. No. WO2022/080072, PCT Pub. Date Apr. 21, 2022.
Claims priority of application No. 2020-173336 (JP), filed on Oct. 14, 2020.
Prior Publication US 2023/0253297 A1, Aug. 10, 2023
Int. Cl. H01L 23/495 (2006.01); H01L 23/31 (2006.01); H01L 23/373 (2006.01); H01L 23/433 (2006.01); H01L 23/498 (2006.01); H01L 25/07 (2006.01); H01L 23/00 (2006.01)
CPC H01L 23/49534 (2013.01) [H01L 23/3121 (2013.01); H01L 23/49517 (2013.01); H01L 23/49579 (2013.01); H01L 24/32 (2013.01); H01L 24/40 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/40175 (2013.01); H01L 2224/48175 (2013.01); H01L 2224/73221 (2013.01); H01L 2224/73263 (2013.01); H01L 2224/73265 (2013.01)] 17 Claims
OG exemplary drawing
 
1. A semiconductor module comprising:
a supporting substrate having a supporting surface that faces in one sense of a thickness direction;
a conductive substrate having an obverse surface and a reverse surface that face away from each other in the thickness direction, the conductive substrate being supported by the supporting substrate such that the reverse surface faces the supporting surface;
a first conductive bonding member provided between the supporting substrate and the conductive substrate and electrically bonding the supporting substrate and the conductive substrate; and
a semiconductor element electrically bonded to the obverse surface and having a switching function,
wherein the first conductive bonding member includes a first base layer made of metal, a first layer, and a second layer, the first layer being provided between the first base layer and the conductive substrate and bonded in direct contact with the conductive substrate at a bonding interface with the conductive substrate, the second layer being provided between the first base layer and the supporting substrate and bonded in direct contact with the supporting substrate at a bonding interface with the supporting substrate.