US 12,406,903 B2
Semiconductor device with two-phase cooling structure
Seogwoo Hong, Suwon-si (KR); Sungchan Kang, Suwon-si (KR); Daehyuk Son, Suwon-si (KR); and Jeongyub Lee, Suwon-si (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed on Jun. 6, 2023, as Appl. No. 18/206,472.
Claims priority of application No. 10-2022-0179735 (KR), filed on Dec. 20, 2022.
Prior Publication US 2024/0203825 A1, Jun. 20, 2024
Int. Cl. H01L 23/473 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2023.01)
CPC H01L 23/473 (2013.01) [H01L 24/16 (2013.01); H01L 25/0655 (2013.01); H01L 2224/16221 (2013.01); H01L 2924/16151 (2013.01); H01L 2924/16152 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A semiconductor device comprising:
a semiconductor chip comprising a semiconductor integrated circuit;
a cooling channel comprising a surface of the semiconductor chip and configured to provide a passage for a coolant to cool the semiconductor chip; and
a plurality of flexible capillary patterns on the surface of the semiconductor chip inside the cooling channel and configured to move the coolant by capillary action,
wherein each capillary pattern of the plurality of flexible capillary patterns comprises a first portion in a length direction of the capillary pattern that contacts and is supported by the surface of the semiconductor chip, and a second portion in the length direction that is spaced apart from and unsupported by the surface of the semiconductor chip,
wherein a curvature of the second portion of each capillary pattern of the plurality of flexible capillary patterns changes according to temperature, and
wherein at least one capillary pattern of the plurality of flexible capillary patterns comprises a plurality of protrusions configured to prevent adhesion with the surface of the semiconductor chip.