US 12,406,900 B2
Sensor apparatus
Hirokazu Nakayama, Kanagawa (JP)
Assigned to SONY SEMICONDUCTOR SOLUTIONS CORPORATION, Kanagawa (JP)
Appl. No. 17/440,992
Filed by SONY SEMICONDUCTOR SOLUTIONS CORPORATION, Kanagawa (JP)
PCT Filed Feb. 7, 2020, PCT No. PCT/JP2020/004709
§ 371(c)(1), (2) Date Sep. 20, 2021,
PCT Pub. No. WO2020/202789, PCT Pub. Date Oct. 8, 2020.
Claims priority of application No. 2019-068608 (JP), filed on Mar. 29, 2019.
Prior Publication US 2022/0165641 A1, May 26, 2022
Int. Cl. H01L 23/38 (2006.01); G01J 1/02 (2006.01); G01J 1/44 (2006.01); H10F 39/00 (2025.01); H10F 77/60 (2025.01)
CPC H01L 23/38 (2013.01) [G01J 1/0271 (2013.01); G01J 1/44 (2013.01); H10F 39/011 (2025.01); H10F 39/804 (2025.01); H10F 77/60 (2025.01); G01J 2001/448 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A sensor apparatus, comprising:
a package substrate that includes:
a first recess portion on a first side of a first surface of the package substrate;
a second recess portion on a bottom surface of the first recess portion; and
a plurality of terminals on a second side of a second surface of the package substrate, wherein the second side is opposite to the first side;
a Peltier element in the second recess portion;
a circuit substrate on an opposite side of a bottom surface of the second recess portion, wherein
the Peltier element is between a bottom surface of the circuit substrate and the bottom surface of the second recess portion,
the bottom surface of the circuit substrate is attached to the bottom surface of the first recess portion, and
the bottom surface of the circuit substrate faces the Peltier element; and
an image sensor on an upper surface of the circuit substrate, wherein
the circuit substrate is different from the image sensor, and
the upper surface of the circuit substrate is opposite to the bottom surface of the circuit substrate.