| CPC H01L 21/76897 (2013.01) [H01L 21/76832 (2013.01); H01L 23/53295 (2013.01); H10B 41/27 (2023.02); H10B 41/30 (2023.02); H10B 41/48 (2023.02)] | 25 Claims |

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1. A microelectronic device, comprising:
a stack structure comprising an alternating sequence of conductive structures and insulative structures arranged in tiers;
memory cells vertically extending through the stack structure, the memory cells comprising a channel material vertically extending through the stack structure;
an additional stack structure vertically overlying the stack structure and comprising additional conductive structures and additional insulative structures arranged in additional tiers;
first pillar structures extending through the additional stack structure and vertically overlying a portion of the memory cells;
second pillar structures adjacent to the first pillar structures and extending through the additional stack structure and vertically overlying another portion of the memory cells; and
slot structures extending through at least a portion of the additional stack structure, the slot structures laterally adjacent to the first pillar structures and to the second pillar structures, wherein a distance between the first pillar structures and the slot structures is substantially equal to a distance between the second pillar structures and the slot structures, the slot structures exhibiting a non-linear shape.
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