US 12,406,873 B2
Lift pin assembly
Wonki Jeong, Cheonan-si (KR); DaeYoun Kim, Daejeon (KR); and DongJun Park, Siheung-si (KR)
Assigned to ASM IP Holding B.V., Almere (NL)
Filed by ASM IP Holding B.V., Almere (NL)
Filed on Dec. 9, 2022, as Appl. No. 18/078,229.
Claims priority of provisional application 63/289,377, filed on Dec. 14, 2021.
Prior Publication US 2023/0187260 A1, Jun. 15, 2023
Int. Cl. H01L 21/687 (2006.01)
CPC H01L 21/68742 (2013.01) [H01L 21/68757 (2013.01); H01L 21/68785 (2013.01)] 17 Claims
OG exemplary drawing
 
1. A lift pin assembly for wafer processing, comprising:
a plurality of lift pins, comprising a top end and a down end, and configured for the top end can move upward to an UP position and move downward to a DOWN position, wherein the top end supports a wafer;
a weight comprising a plurality of lift pin holes and is configured to connect the plurality of lift pins;
a plurality of weight supports, each of them are configured to attach to the plurality of lift pins respectively and each of them are to be placed in the plurality of lift pin holes respectively;
a bushing configured to secure a pass through space for the lift pin in a heating block; and
a cap for the bushing configured as a set up exit in the lower heating block for the lift pin.