US 12,406,809 B2
Multilayer electronic component
Dong Geon Yoo, Suwon-si (KR); Su Been Kim, Suwon-si (KR); and Dong Jun Jung, Suwon-si (KR)
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed on Apr. 17, 2023, as Appl. No. 18/135,328.
Claims priority of application No. 10-2022-0056542 (KR), filed on May 9, 2022.
Prior Publication US 2023/0360855 A1, Nov. 9, 2023
Int. Cl. H01G 4/30 (2006.01); C04B 35/468 (2006.01); C04B 35/64 (2006.01); H01G 4/008 (2006.01); H01G 4/012 (2006.01); H01G 4/12 (2006.01)
CPC H01G 4/30 (2013.01) [C04B 35/4682 (2013.01); C04B 35/64 (2013.01); H01G 4/008 (2013.01); H01G 4/012 (2013.01); H01G 4/1227 (2013.01)] 13 Claims
OG exemplary drawing
 
1. A multilayer electronic component comprising:
a body including dielectric layers and internal electrodes; and
external electrodes disposed on end surfaces of the body and connected to the internal electrodes,
wherein
at least one of the dielectric layers includes a plurality of dielectric grains,
at least one of the plurality of dielectric grains has a core-interface shell-shell structure including an inner core region, an interface shell region including first and second interface shell regions covering at least a portion of the core region, and a shell region covering at least a portion of the interface shell region,
the dielectric grain having the core-interface shell-shell structure includes a barium titanate (BaTiO3)-based base main component, a first subcomponent including silicon (Si), and a second subcomponent including at least one selected from the group consisting of manganese (Mn), vanadium (V), chromium (Cr), iron (Fe), nickel (Ni), cobalt (Co), copper (Cu), zinc (Zn), and tin (Sn), and
an average content of the first subcomponent is highest in the first interface shell region, and an average content of the second subcomponent is highest in the second interface shell region.