| CPC H01G 4/30 (2013.01) [H01G 4/008 (2013.01); H01G 4/012 (2013.01); H01G 4/12 (2013.01); H01G 4/2325 (2013.01); H01G 4/248 (2013.01)] | 22 Claims |

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1. An electronic component, comprising:
a multilayer capacitor including
a capacitor body including a dielectric layer and a plurality of first and second internal electrodes alternately disposed with the dielectric layer interposed therebetween, stacked in a stacking direction, and including first and second surfaces facing each other in the stacking direction, third and fourth surfaces connected to the first and second surfaces and facing each other, and one end of each of the first and second internal electrodes extends from the third and fourth surfaces, respectively, and
an external electrode having a connection portion disposed on the third and fourth surfaces of the capacitor body to be connected to one of the first and second internal electrodes;
a frame terminal disposed outside the connection portion;
a conductive bonding portion disposed between the external electrode and the frame terminal;
a band portion disposed to at least cover entirety of edges where the first and second surfaces and the third and fourth surfaces of the capacitor body meet; and
a non-conductive material layer disposed to cover at least an entirety of a region of an outermost surface of the band portion disposed at the edges of the capacitor body where the first and second surfaces and the third and fourth surfaces meet, while exposing at least a portion of the first and second surfaces disposed between corresponding band portions.
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