| CPC H01F 27/2804 (2013.01) [H01F 27/29 (2013.01); H01F 41/041 (2013.01); H03H 7/0115 (2013.01); H01F 2027/2809 (2013.01)] | 16 Claims |

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1. A coil component comprising:
first and second coils magnetically coupled with each other;
a ceramic base body including a plurality of ceramic layers stacked on each other, a pair of main surfaces opposing each other, and side surfaces connecting the main surfaces;
at least one first wiring pattern inside the ceramic base body and defining at least a portion of the first coil;
at least one second wiring pattern on a top layer of the first wiring pattern and defining at least a portion of the second coil; and
at least one third wiring pattern between the first and second wiring patterns and including a portion defining a portion of the first coil and a portion defining a portion of the second coil; wherein
each of the first and second wiring patterns has a rectangular or substantially rectangular shape;
at least one of the first and second coils includes at least one combination of wiring patterns that are stacked on each other with a positional displacement so as to include an intersecting portion at which corresponding sides of the wiring patterns intersect with each other as viewed from a direction of the main surfaces;
the first coil includes:
a portion including a plurality of wiring patterns connected in parallel with each other which are provided by electrically connecting a plurality of the first wiring patterns with each other using a first via-conductor; and
a portion including a plurality of wiring patterns connected in parallel with each other which are provided by electrically connecting a plurality of the first wiring patterns with each other and a plurality of the third wiring patterns with each other using second and third via-conductors which pass through the plurality of the first wiring patterns and the plurality of the third wiring patterns;
the second coil includes:
a portion including a plurality of wiring patterns connected in parallel with each other which are provided by electrically connecting a plurality of the second wiring patterns with each other using a fourth via-conductor; and
a portion including a plurality of wiring patterns connected in parallel with each other which are provided by electrically connecting a plurality of the second wiring patterns with each other and a plurality of the third wiring patterns with each other using fifth and sixth via-conductors which pass through the plurality of the second wiring patterns and the plurality of the third wiring patterns; and
the ceramic base body includes:
a first electrode electrically connected to the plurality of first wiring patterns;
a second electrode electrically connected to the plurality of second wiring patterns; and
a third electrode electrically connected to the plurality of third wiring patterns which are connected to a plurality of wiring patterns connected with each other by a seventh via-conductor.
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