US 12,406,792 B2
Electronic component and method of manufacturing the same
Hirotaka Wakabayashi, Tokyo (JP)
Assigned to TAIYO YUDEN CO., LTD., Tokyo (JP)
Filed by TAIYO YUDEN CO., LTD., Tokyo (JP)
Filed on Dec. 22, 2020, as Appl. No. 17/131,434.
Claims priority of application No. 2019-238965 (JP), filed on Dec. 27, 2019.
Prior Publication US 2021/0202154 A1, Jul. 1, 2021
Int. Cl. H01F 27/28 (2006.01); H01F 1/33 (2006.01); H01F 27/32 (2006.01); H05K 1/16 (2006.01)
CPC H01F 27/2804 (2013.01) [H01F 1/33 (2013.01); H01F 27/32 (2013.01); H05K 1/162 (2013.01); H05K 1/165 (2013.01); H01F 2027/2809 (2013.01)] 8 Claims
OG exemplary drawing
 
1. An electronic component, comprising:
a base body;
a conductor provided inside or outside the base body;
a first external electrode and a second external electrode both electrically connected to the conductor; and
a first film positioned between the first external electrode and one end portion of the conductor electrically connected to the first external electrode, and
a second film positioned between the second external electrode and the other end portion of the conductor electrically connected to the second external electrode,
wherein a diffusion velocity in the first film and the second film is lower than that in the first external electrode and the second external electrode, and
wherein the first film and the second film are nitride films, carbonized films, or oxynitride films, and
wherein the nitride films include TaN, FeN, SiN or AlN, and the oxynitride films include TaON.