US 12,406,700 B2
System and method for modular hard drive enclosure with device cooling
James Utz, Austin, TX (US); Leslye Paniagua Sanchez, Leander, TX (US); and Bilal Ahmed, Austin, TX (US)
Assigned to Dell Products L.P., Round Rock, TX (US)
Filed by Dell Products L.P., Round Rock, TX (US)
Filed on May 18, 2023, as Appl. No. 18/319,935.
Prior Publication US 2024/0386917 A1, Nov. 21, 2024
Int. Cl. G11B 33/14 (2006.01); H05K 5/02 (2006.01)
CPC G11B 33/142 (2013.01) [H05K 5/0213 (2013.01); H05K 5/026 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A storage device, comprising:
a circuit card;
a chip:
positioned on the circuit card, and
adapted to:
store data, and
generate heat as a byproduct of storing data; and
a connector:
positioned with the circuit card, and
adapted to facilitate formation of operable connections between the chip and other devices; and
a housing adapted to enhance thermal dissipation of the heat in an airflow, the housing comprising:
a housing top adapted to dissipate a first portion of heat, the housing top comprising:
ridges adapted to provide a surface area to which a first portion of the airflow is exposed, and
a housing bottom adapted to dissipate a second portion of the heat, the housing bottom comprising:
air vents adapted to facilitate a second portion of the airflow that dissipates a first sub portion of the second portion of the heat.