US 12,406,688 B2
Embedded electromagnetic interference shield
Jason Liang, Campbell, CA (US); Icko E. T. Iben, Santa Clara, CA (US); and Hoodin Hamidi, San Francisco, CA (US)
Assigned to INTERNATIONAL BUSINESS MACHINES CORPORATION, Armonk, NY (US)
Filed by INTERNATIONAL BUSINESS MACHINES CORPORATION, Armonk, NY (US)
Filed on Jun. 9, 2023, as Appl. No. 18/332,334.
Prior Publication US 2024/0412758 A1, Dec. 12, 2024
Int. Cl. G11B 5/11 (2006.01)
CPC G11B 5/11 (2013.01) [G11B 5/112 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A device for use in a magnetic tape head, comprising:
a chiplet including a substrate and at least one writer positioned on the substrate; and
an electromagnetic interference shield embedded in the chiplet, the electromagnetic interference shield configured to inhibit electromagnetic interference during operation of the at least one writer; and
an undercoat region on a surface of the substrate, the undercoat region comprising an insulating material, the undercoat region extending between the substrate and the at least one writer;
wherein at least a portion of the electromagnetic interference shield is positioned between the surface of the substrate and the at least one writer;
wherein the at least a portion of electromagnetic interference shield is sandwiched directly between a first part of the undercoat region and a second part of the undercoat region, the first part positioned between the at least a portion of the electromagnetic interference shield and the surface of the substrate, the second part positioned between the at least a portion of the electromagnetic interference shield and the at least one writer; and
wherein no reader is positioned between the at least one writer and the substrate along a line orthogonal to the surface of the substrate extending through the at least one writer.