US 12,406,355 B2
System and method for tracing components of electronic assembly
Eyal Isachar Weiss, Bnei Reem (IL); and Zeev Efrat, Ramat Hasharon (IL)
Assigned to CYBORD LTD, Tel Aviv (IL)
Appl. No. 18/009,999
Filed by CYBORD LTD., Tel Aviv (IL)
PCT Filed Jun. 10, 2021, PCT No. PCT/IL2021/050708
§ 371(c)(1), (2) Date Dec. 13, 2022,
PCT Pub. No. WO2021/250679, PCT Pub. Date Dec. 16, 2021.
Claims priority of provisional application 63/038,757, filed on Jun. 13, 2020.
Prior Publication US 2023/0237642 A1, Jul. 27, 2023
Int. Cl. G06T 7/00 (2017.01); G06T 7/73 (2017.01); G06V 10/764 (2022.01)
CPC G06T 7/001 (2013.01) [G06T 7/74 (2017.01); G06V 10/764 (2022.01); G06T 2207/30141 (2013.01); G06T 2207/30148 (2013.01); G06V 2201/06 (2022.01)] 18 Claims
OG exemplary drawing
 
1. A method of monitoring quality of an electronic assembly comprising a plurality of electronic components, the method comprising:
acquiring at least one image of an electronic assembly during a process of assembling a plurality of electronic components to the electronic assembly;
acquiring at least two images of an electronic component of the plurality of electronic components in real-time during the assembling process;
processing the at least one image of the electronic assembly and the at least two images of the electronic component in real time during the assembling process to identify physical features of the electronic component and determine a true state of the component comprising data based on the identified physical features;
acquiring set-up information for the electronic component that characterizes logistical information associated with the electronic component,
vetting consistency of the true state and set-up information in real-time;
undertaking an action to mitigate damage to the assembling process if the vetting fails.