US 12,406,161 B2
Transponders and sensors for implantable medical devices and methods of use thereof
Randolph Keith Geissler, Minneapolis, MN (US); Rudy A. Mazzocchi, Coral Springs, FL (US); Juan José Chacón Quirós, Alajuela (CR); and Steven A. Lewis, Bloomington, MN (US)
Assigned to Establishment Labs S.A., Alajuela (CR)
Filed by ESTABLISHMENT LABS S.A., Alajuela (CR)
Filed on Apr. 24, 2024, as Appl. No. 18/644,788.
Application 18/644,788 is a continuation of application No. 18/101,684, filed on Jan. 26, 2023, granted, now 12,001,904.
Application 18/101,684 is a continuation of application No. 17/590,491, filed on Feb. 1, 2022, granted, now 11,593,601.
Application 17/590,491 is a continuation of application No. 17/064,001, filed on Oct. 6, 2020, granted, now 11,537,829.
Application 17/064,001 is a continuation of application No. 16/209,063, filed on Dec. 4, 2018, granted, now 10,824,925.
Application 16/209,063 is a continuation of application No. 15/427,599, filed on Feb. 8, 2017, granted, now 10,176,412.
Claims priority of provisional application 62/313,218, filed on Mar. 25, 2016.
Claims priority of provisional application 62/293,052, filed on Feb. 9, 2016.
Prior Publication US 2024/0273327 A1, Aug. 15, 2024
Int. Cl. G06K 19/02 (2006.01); A61B 5/00 (2006.01); A61B 5/06 (2006.01); A61B 90/00 (2016.01); A61B 90/98 (2016.01); A61F 2/12 (2006.01); G06K 19/04 (2006.01); G06K 19/077 (2006.01); A61F 2/48 (2006.01); G06K 19/07 (2006.01)
CPC G06K 19/02 (2013.01) [A61B 5/0031 (2013.01); A61B 5/062 (2013.01); A61B 90/02 (2016.02); A61B 90/98 (2016.02); A61F 2/12 (2013.01); G06K 19/04 (2013.01); G06K 19/0772 (2013.01); G06K 19/07758 (2013.01); G06K 19/07773 (2013.01); G06K 19/07779 (2013.01); A61B 2560/0219 (2013.01); A61F 2/484 (2021.08); G06K 19/07 (2013.01)] 18 Claims
OG exemplary drawing
 
1. An implantable medical device comprising:
a shell defining a cavity, the shell including one or more layers;
wherein the one or more layers includes an electroconductive layer; and
a transponder enclosed within the electroconductive layer, the transponder including:
a capsule having a cavity;
an enameled wire having a first end and a second end; and
an integrated circuit chip coupled to each of the first end and the second end;
wherein the capsule configured to house the enameled wire and the integrated circuit chip;
wherein the capsule includes an adhesive material filling at least 30 percent of the cavity.