US 12,406,156 B2
Method and system for imprinting unique identifiers on semiconductor dies
Richard Beaudry, Granby (CA); Cédric Canu, Granby (CA); and Maurice Delafosse, Granby (CA)
Assigned to DIGITHO TECHNOLOGIES INC., Granby (CA)
Filed by Digitho Technologies Inc., Granby (CA)
Filed on Jan. 5, 2023, as Appl. No. 18/093,730.
Claims priority of provisional application 63/421,612, filed on Nov. 2, 2022.
Prior Publication US 2024/0143957 A1, May 2, 2024
Int. Cl. G06K 9/36 (2006.01); G03F 7/00 (2006.01); G06K 7/14 (2006.01); G06K 19/06 (2006.01); H01L 23/544 (2006.01)
CPC G06K 7/1417 (2013.01) [G03F 7/0002 (2013.01); G06K 19/06037 (2013.01); H01L 23/544 (2013.01); H01L 2223/54413 (2013.01)] 28 Claims
OG exemplary drawing
 
1. A method for imprinting a unique identifier on a semiconductor die at a photolithography station, the method comprising:
receiving the substrate at the photolithography station, the substrate comprising a photosensitive layer and an area for forming a plurality of semiconductor dies;
forming, by a projector of the photolithography station, a plurality of circuits on the substrate using at least one photolithography mask, each circuit corresponding to a semiconductor die;
providing, by a processor in communication with the photolithography station, a unique identifier for each die;
imprinting, by the projector, the unique identifier on each semiconductor die on the substrate using at least one digital photomask, the at least one digital photomask comprising dynamically controlled pixels controllable to define a unique pattern for the unique identifier; and
removing the substrate comprising the plurality of semiconductor dies from the photolithography station, each semiconductor die comprising the circuit and the unique identifier; wherein each unique identifier is stored in a record of a database for subsequent retrieval, each record comprising at least said unique identifier and information unique to the semiconductor die.