| CPC G06F 21/85 (2013.01) [G06F 21/76 (2013.01)] | 19 Claims |

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1. An integrated circuit comprising:
an information technology services management (ITSM) chiplet connected to a provisioning network, wherein the ITSM chiplet is configured to perform at least one of provisioning, managing, monitoring, or maintaining a server based on instructions received from the provisioning network; and
one or more processing unit chiplets;
wherein the ITSM chiplet is connected to the one or more processing unit chiplets via a die-to-die (D2D) interconnect, the D2D interconnect comprising a physical separation that physically isolates the ITSM chiplet from the one or more processing unit chiplets.
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