US 12,406,098 B2
Systems and methods for classifying puf signature modules of integrated circuits
Cheng-En Lee, Hsinchu (TW); and Shih-Lien Linus Lu, Hsinchu (TW)
Assigned to Taiwan Semiconductor Manufacturing Company Limited, Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Company Limited, Hsinchu (TW)
Filed on Aug. 9, 2023, as Appl. No. 18/446,838.
Application 18/446,838 is a continuation of application No. 16/785,877, filed on Feb. 10, 2020, granted, now 11,783,092.
Prior Publication US 2023/0385459 A1, Nov. 30, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. G06F 21/73 (2013.01); H04L 9/32 (2006.01)
CPC G06F 21/73 (2013.01) [H04L 9/3278 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method comprising:
providing signals to a cell under a plurality of conditions;
under a first condition of the plurality of conditions, providing a first signal to a first wordline connected to a gate terminal of a first transistor within a first branch of the cell and a second signal to a second wordline connected to a gate terminal of a second transistor within a second branch of the cell;
determining a number of times that cell outputs of the cell are consistent under the plurality of conditions; and
determining a device classification value, based on a comparison between the determined number of times and a threshold number or range, for a plurality of cells.