US 12,405,904 B2
Sharing memory and I/O services between nodes
Debendra Das Sharma, Saratoga, CA (US); Robert G. Blankenship, Tacoma, WA (US); Suresh S. Chittor, Portland, OR (US); Kenneth C. Creta, Gig Harbor, WA (US); Balint Fleischer, Groton, MA (US); Michelle C. Jen, Mountain View, CA (US); Mohan J. Kumar, Aloha, OR (US); and Brian S. Morris, Santa Clara, CA (US)
Assigned to Intel Corporation, Santa Clara, CA (US)
Filed by Intel Corporation, Santa Clara, CA (US)
Filed on Jan. 22, 2024, as Appl. No. 18/419,159.
Application 18/419,159 is a continuation of application No. 17/485,360, filed on Sep. 25, 2021.
Application 17/485,360 is a continuation of application No. 17/170,619, filed on Feb. 8, 2021.
Application 17/170,619 is a continuation of application No. 15/039,468, granted, now 10,915,468, issued on Feb. 9, 2021, previously published as PCT/US2013/077785, filed on Dec. 26, 2013.
Prior Publication US 2024/0160585 A1, May 16, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. G06F 13/16 (2006.01); G06F 12/14 (2006.01); G06F 13/38 (2006.01); G06F 13/42 (2006.01)
CPC G06F 13/1663 (2013.01) [G06F 12/1475 (2013.01); G06F 13/385 (2013.01); G06F 13/4282 (2013.01); G06F 2212/1052 (2013.01); G06F 2213/0026 (2013.01); Y02D 10/00 (2018.01)] 20 Claims
OG exemplary drawing
 
1. An apparatus comprising:
a first die comprising a port to couple the first die to a second die over a die-to-die interconnect, wherein the port comprises circuitry to:
implement a plurality of protocols;
implement a physical layer of the die-to-die interconnect;
send first protocol identification data over the physical layer, wherein the first protocol identification data comprises a first code to identify a first protocol in the plurality of protocols;
send first data over the interconnect to the second die, wherein the first data comprises link layer data of the first protocol;
send second protocol identification data over the physical layer, wherein the second protocol identification data comprises a second code to identify a different second protocol in the plurality of protocols; and
send second data over the interconnect to the second die, wherein the second data comprise link layer flits of the second protocol.