US 12,405,869 B2
Test apparatus for testing a mobile AP
Min Cheol Kim, Chungcheongnam-do (KR); and Sol Lee, Chungcheongnam-do (KR)
Assigned to TSE CO., LTD., Chungcheongnam-Do (KR)
Filed by TSE CO., LTD., Chungcheongnam-do (KR)
Filed on Jan. 9, 2023, as Appl. No. 18/151,872.
Claims priority of application No. 10-2022-0011042 (KR), filed on Jan. 25, 2022.
Prior Publication US 2023/0236941 A1, Jul. 27, 2023
Int. Cl. G06F 11/22 (2006.01); G01R 31/28 (2006.01); H04M 1/24 (2006.01)
CPC G06F 11/2236 (2013.01) [G01R 31/2863 (2013.01); H04M 1/24 (2013.01)] 9 Claims
OG exemplary drawing
 
1. A test apparatus for testing a mobile application processor (AP) provided with an AP package and a memory package, the test apparatus comprising:
a lower test socket mounted on a tester and connected to the AP package put on an upper side thereof;
an upper test socket mounted with the memory package and connected to the AP package put on a lower side thereof;
an upper mechanism configured to accommodate the memory package and mounted with the upper test socket; and
a heat dissipation device disposed on the upper mechanism,
wherein the upper test socket is configured to include: an inelastic conductive housing provided with a plurality of housing holes penetratingly formed in a thickness direction, an insulating coating layer coated around the plurality of housing holes, and a conductive part formed in a form in which a plurality of conductive particles are included in an elastic insulating material, disposed in the housing holes, and insulated from the inelastic conductive housing by the insulating coating layer.