US 12,405,748 B2
Buffer chip, and semiconductor package including buffer chip and memory chips
Seong Ju Lee, San Jose, CA (US)
Assigned to SK hynix Inc., Icheon-si (KR)
Filed by SK hynix Inc., Icheon-si (KR)
Filed on Nov. 27, 2023, as Appl. No. 18/520,228.
Claims priority of provisional application 63/530,853, filed on Aug. 4, 2023.
Claims priority of provisional application 63/462,854, filed on Apr. 28, 2023.
Prior Publication US 2024/0361954 A1, Oct. 31, 2024
Int. Cl. G06F 3/06 (2006.01)
CPC G06F 3/0656 (2013.01) [G06F 3/0604 (2013.01); G06F 3/0673 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A buffer chip comprising:
a chip select signal reception circuit for receiving one or more system chip select signals transmitted from a memory controller;
a chip ID reception circuit for receiving chip ID information transmitted from the memory controller;
a chip select signal generation circuit that generates memory chip select signals by using the one or more system chip select signals and the chip ID information; and
a chip select signal transmission circuit that transmits the memory chip select signals to a plurality of memory chips;
a command address reception circuit for receiving command address signals transmitted from the memory controller;
a command address delay circuit that delays, by a set latency, the command address signals received by the command address reception circuit;
a command address transmission circuit for transmitting the command address signals delayed by the command address delay circuit to the plurality of memory chips; and
a setting change circuit for changing a command address latency of the plurality of memory chips to be different from a setting value of the memory controller.