US 12,405,647 B2
Mobile terminal and middle frame assembly
Yongfu Sun, Shenzhen (CN); Jie Yang, Dongguan (CN); and Jian Shi, Shanghai (CN)
Assigned to HUAWEI TECHNOLOGIES CO., LTD., Shenzhen (CN)
Filed by HUAWEI TECHNOLOGIES CO., LTD., Guangdong (CN)
Filed on Sep. 23, 2022, as Appl. No. 17/951,274.
Application 17/951,274 is a continuation of application No. PCT/CN2021/082689, filed on Mar. 24, 2021.
Claims priority of application No. 202010217496.3 (CN), filed on Mar. 24, 2020; and application No. 202020393505.X (CN), filed on Mar. 24, 2020.
Prior Publication US 2023/0022994 A1, Jan. 26, 2023
Int. Cl. G06F 1/20 (2006.01); H01Q 1/02 (2006.01); H05K 7/20 (2006.01)
CPC G06F 1/203 (2013.01) [H01Q 1/02 (2013.01); H05K 7/20336 (2013.01)] 25 Claims
OG exemplary drawing
 
1. A mobile terminal comprising a mainboard, a heat source and a middle frame assembly, wherein:
the mainboard is installed on the middle frame assembly, and the heat source is disposed on the mainboard;
the middle frame assembly comprises a middle frame, one or more heat pipes, and a first vapor chamber;
the middle frame comprises a heat dissipation region corresponding to the heat source, and the first vapor chamber is accommodated in the heat dissipation region and is configured to dissipate heat from the heat source;
the one or more heat pipes are connected to the first vapor chamber and are configured to dissipate heat from the first vapor chamber;
the mobile terminal includes electronic components and an internal conducting wire; and
a wire groove is disposed on an outer surface of at least one of the one or more heat pipes, the wire groove is configured to fasten the internal conducting wire, and the conducting wire is configured to electrically connect the electronic components.