US 12,405,520 B2
Light source fixing assembly and projection device
Tung-Yi Ko, Hsin-Chu (TW); and Yi-Chou Tsai, Hsin-Chu (TW)
Assigned to Coretronic Corporation, Hsin-Chu (TW)
Filed by Coretronic Corporation, Hsin-Chu (TW)
Filed on Jan. 5, 2023, as Appl. No. 18/093,337.
Claims priority of application No. 202210064619.3 (CN), filed on Jan. 20, 2022.
Prior Publication US 2023/0229067 A1, Jul. 20, 2023
Int. Cl. G03B 21/20 (2006.01); G03B 21/16 (2006.01)
CPC G03B 21/20 (2013.01) [G03B 21/16 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A light source fixing assembly applied to a projection device, the light source fixing assembly comprising:
an optical engine housing, having an outer surface;
a circuit board, having a bearing surface, a first fixing region and a first bonding region which is conductive, wherein the bearing surface faces the outer surface of the optical engine housing, and the first bonding region is on the bearing surface;
a light emitting element, disposed on the bearing surface of the circuit board, wherein a light emitting surface of the light emitting element faces an interior of the optical engine housing;
a flexible circuit board, disposed between the optical engine housing and the circuit board, wherein the flexible circuit board has a first surface, a second surface opposite to the first surface, and a second fixing region, the first surface faces the outer surface of the optical engine housing, the second surface faces the bearing surface of the circuit board, the second surface has a second bonding region which is conductive, and the second bonding region corresponds to the first bonding region;
a fixing element, disposed to pass through the first fixing region and the second fixing region in sequence and fix the circuit board and the flexible circuit board onto the outer surface of the optical engine housing; and
an abutting element, abutting against the flexible circuit board and corresponding to the second bonding region, so that the first bonding region of the circuit board is electrically connected to the second bonding region of the flexible circuit board, wherein an orthographic projection of the abutting element on the second surface does not overlap with the second fixing region.