US 12,405,459 B2
Endoscope and endoscope manufacturing method
Toshiyuki Fujii, Machida (JP)
Assigned to OLYMPUS MEDICAL SYSTEMS CORP., Tokyo (JP)
Filed by OLYMPUS MEDICAL SYSTEMS CORP., Hachioji (JP)
Filed on Mar. 22, 2024, as Appl. No. 18/613,737.
Claims priority of provisional application 63/491,968, filed on Mar. 24, 2023.
Prior Publication US 2024/0319490 A1, Sep. 26, 2024
Int. Cl. G02B 23/24 (2006.01); H04N 23/50 (2023.01)
CPC G02B 23/2484 (2013.01) [H04N 23/555 (2023.01)] 20 Claims
OG exemplary drawing
 
1. An endoscope comprising:
a first substrate comprising:
a plurality of first pads;
a plurality of second pads configured to be connected to a connection body; and
a wiring adjustment circuit disposed between the plurality of first pads and the plurality of second pads,
a plurality of first cables, each of the plurality of first cables including a first end, the first end connected to the plurality of first pads;
wherein the wiring adjustment circuit is configured to electrically connect each of the plurality of first pads to each of the plurality of second pads corresponding to each of the plurality of first cables.