US 12,405,434 B2
Embedding a photonic integrated circuit in a semiconductor package for high bandwidth memory and compute
Ankur Aggarwal, Pleasanton, CA (US); Subal Sahni, Santa Clara, CA (US); Philip Winterbottom, San Jose, CA (US); and Martinus Bos, San Jose, CA (US)
Assigned to Celestial AI Inc., Santa Clara, CA (US)
Filed by Celestial AI Inc., Santa Clara, CA (US)
Filed on Feb. 22, 2024, as Appl. No. 18/584,748.
Application 18/584,748 is a continuation of application No. 18/583,749, filed on Feb. 21, 2024.
Claims priority of provisional application 63/616,465, filed on Dec. 29, 2023.
Prior Publication US 2025/0216632 A1, Jul. 3, 2025
Int. Cl. G02B 6/42 (2006.01); G02B 6/12 (2006.01); G02B 6/124 (2006.01); G02B 6/13 (2006.01); G02B 6/43 (2006.01); H01L 21/56 (2006.01); H01L 25/16 (2023.01); H10B 80/00 (2023.01)
CPC G02B 6/4283 (2013.01) [G02B 6/12002 (2013.01); G02B 6/124 (2013.01); G02B 6/13 (2013.01); G02B 6/42 (2013.01); G02B 6/4213 (2013.01); G02B 6/4214 (2013.01); G02B 6/4226 (2013.01); G02B 6/4239 (2013.01); G02B 6/4259 (2013.01); G02B 6/428 (2013.01); G02B 6/4293 (2013.01); G02B 6/43 (2013.01); H01L 21/56 (2013.01); H01L 25/167 (2013.01); G02B 2006/12107 (2013.01); H10B 80/00 (2023.02)] 5 Claims
OG exemplary drawing
 
1. A method for embedding a photonic integrated circuit (PIC) in a package comprising the PIC and at least one electronic integrated circuit (EIC), the PIC comprising an active portion which consumes electrical power when the PIC is activated and a passive portion comprising an optical transmission medium configured to propagate an optical signal to or from the active portion, the method comprising:
masking a portion of a surface of the PIC with a masking material, the portion corresponding to one or more photonic ports in the passive portion of the PIC;
depositing a layer of a molding material to at least partially encase the PIC including the masking material;
removing a portion of the layer of the molding material sufficient to expose the masking material;
removing the masking material from the surface of the PIC to provide a cavity in the molding material, the cavity exposing the one or more photonic ports;
filling the cavity with an optically transparent medium such that the optical signal can be received or transmitted through the cavity;
disposing the PIC on a glass carrier
peeling off the glass carrier; and
after peeling off the glass carrier, mounting the package on a printed circuit board (PCB).