US 12,405,432 B2
Manufacturing method of optical module
Yasutaka Mizuno, Osaka (JP); and Munetaka Kurokawa, Osaka (JP)
Assigned to SUMITOMO ELECTRIC INDUSTRIES, LTD., Osaka (JP)
Filed by SUMITOMO ELECTRIC INDUSTRIES, LTD., Osaka (JP)
Filed on Jun. 28, 2023, as Appl. No. 18/342,916.
Claims priority of application No. 2022-107892 (JP), filed on Jul. 4, 2022.
Prior Publication US 2024/0004149 A1, Jan. 4, 2024
Int. Cl. G02B 6/42 (2006.01); B23K 11/06 (2006.01); H01S 5/022 (2021.01)
CPC G02B 6/4251 (2013.01) [B23K 11/061 (2013.01); G02B 6/4237 (2013.01); G02B 6/4268 (2013.01); G02B 6/4272 (2013.01); H01S 5/022 (2013.01)] 6 Claims
OG exemplary drawing
 
1. A manufacturing method of an optical module including a package and a lid, the package having an opening to be sealed with the lid, the manufacturing method comprising:
placing the lid on the package so that the lid covers the opening;
putting a metal block on the lid, the metal block having a first surface touching a top surface of the lid;
welding the lid to the package using a seam welding machine, the first surface of the metal block touching the top surface of the lid during the welding, the metal block being configured not to interfere with the seam welding machine; and
detaching the metal block from the lid.