US 12,405,365 B2
Environment model using cross-sensor feature point referencing
Christian Thiel, Oberaudorf (DE); Paul Barnard, Radstock (GB); and Bingtao Gao, Sichua (CN)
Assigned to QUALCOMM Technologies Inc., San Diego, CA (US)
Filed by QUALCOMM Technologies Inc., San Diego, CA (US)
Filed on Jun. 7, 2024, as Appl. No. 18/737,470.
Application 18/737,470 is a continuation of application No. 18/052,048, filed on Nov. 2, 2022, granted, now 12,061,252.
Application 18/052,048 is a continuation of application No. 16/464,622, granted, now 11,513,211, issued on Nov. 29, 2022, previously published as PCT/CN2016/107748, filed on Nov. 29, 2016.
Prior Publication US 2024/0329231 A1, Oct. 3, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. G01S 13/86 (2006.01); G01S 13/42 (2006.01); G01S 13/89 (2006.01); G06N 20/00 (2019.01); G06T 7/73 (2017.01); G06T 17/05 (2011.01)
CPC G01S 13/867 (2013.01) [G01S 13/426 (2013.01); G01S 13/89 (2013.01); G06N 20/00 (2019.01); G06T 7/73 (2017.01); G06T 17/05 (2013.01); G06T 2207/30252 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An apparatus for generating a three dimensional reference model, comprising:
a memory storing instructions; and
at least one processor communicatively coupled to the memory and configured to execute the instructions to:
receive first scan data for a first type of sensor, and second scan data for a second type of sensor, each of the first scan data and second scan data characterizing portions of a scanned environment;
identify first feature points in the first scan data, and second feature points in the second scan data;
generate a first three dimensional vector model based on the first feature points, and a second three dimensional vector model based on the second feature points;
generate a three dimensional reference model based on the first three dimensional vector model and the second three dimensional vector model; and
store the three dimensional reference model.