US 12,405,198 B2
Photosensitive resin composition, method for selecting photosensitive resin composition, method for producing patterned cured film, and method for producing semiconductor device
Kazuyuki Mitsukura, Tokyo (JP); Yuki Imazu, Tokyo (JP); Yu Aoki, Tokyo (JP); and Takuya Komine, Tokyo (JP)
Assigned to Resonac Corporation, Tokyo (JP)
Appl. No. 17/801,378
Filed by Showa Denko Materials Co., Ltd., Tokyo (JP)
PCT Filed Oct. 26, 2020, PCT No. PCT/JP2020/040109
§ 371(c)(1), (2) Date Aug. 22, 2022,
PCT Pub. No. WO2021/171697, PCT Pub. Date Sep. 2, 2021.
Claims priority of application No. 2020-030134 (JP), filed on Feb. 26, 2020; and application No. 2020-030486 (JP), filed on Feb. 26, 2020.
Prior Publication US 2023/0104391 A1, Apr. 6, 2023
Int. Cl. G01N 3/32 (2006.01); G03F 7/22 (2006.01); G03F 7/40 (2006.01); H01L 23/00 (2006.01)
CPC G01N 3/32 (2013.01) [G03F 7/22 (2013.01); G03F 7/40 (2013.01); G01N 2203/0005 (2013.01); G01N 2203/0017 (2013.01); G01N 2203/0067 (2013.01); G01N 2203/0073 (2013.01); G01N 2203/0222 (2013.01); H01L 24/05 (2013.01); H01L 24/13 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/13144 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A method for selecting a photosensitive resin composition, the method comprising:
exposing a resin film of a photosensitive resin composition at 100 to 2000 mJ/cm2 and heat-treating the resin film at 150° C. to 250° C. for 1 to 3 hours under nitrogen to produce a strip sample of a cured film having a film thickness of 10 μm and a width of 10 mm;
performing a fatigue test of repeatedly pulling the strip sample under the conditions including a set temperature of 25° C., a distance between chucks of 20 mm, a testing rate of 5 mm/min, and a cyclic load stress of 100 MPa; and
selecting a photosensitive resin composition satisfying the following condition: a number of times of pulling required until the strip sample breaks in the fatigue test is 100 or more cycles.