US 12,405,164 B2
Spatial optical emission spectroscopy for etch uniformity
Blake Erickson, Gilroy, CA (US); Keith Berding, Truckee, CA (US); Michael Kutney, Santa Clara, CA (US); Zhaozhao Zhu, Milpitas, CA (US); Tsung Feng Wu, San Jose, CA (US); Michael D. Willwerth, Campbell, CA (US); and Jeffrey Ludwig, San Jose, CA (US)
Assigned to Applied Materials, Inc., Santa Clara, CA (US)
Filed by Applied Materials, Inc., Santa Clara, CA (US)
Filed on Apr. 25, 2023, as Appl. No. 18/138,914.
Application 18/138,914 is a continuation of application No. 17/234,940, filed on Apr. 20, 2021, granted, now 11,668,602.
Prior Publication US 2023/0258500 A1, Aug. 17, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. G01J 3/32 (2006.01); G01J 3/02 (2006.01); G01J 3/443 (2006.01); G01N 21/21 (2006.01); G01N 21/25 (2006.01); G01N 21/68 (2006.01); G01N 21/84 (2006.01); G01N 21/95 (2006.01)
CPC G01J 3/32 (2013.01) [G01J 3/0291 (2013.01); G01N 21/255 (2013.01); G01N 21/68 (2013.01); G01N 21/9501 (2013.01); G01J 3/443 (2013.01); G01N 21/211 (2013.01); G01N 2021/8416 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An apparatus comprising:
a base component; and
a plurality of collimators housed within the base component, each collimator of the plurality of collimators corresponding to a respective location of a plurality of locations of a wafer in an etch chamber, wherein the plurality of locations comprises a center location of the wafer, a plurality of inner ring locations along an inner ring of the wafer associated with a first set of radially symmetric optical emission spectroscopy (OES) signal sampling paths, and a plurality of outer ring locations along an outer ring of the wafer associated with a second set of radially symmetric OES signal sampling paths.