US 12,405,106 B2
Device and method for measuring thickness
Ohjune Kwon, Yongin-si (KR); and Jinho Hyun, Yongin-si (KR)
Assigned to SAMSUNG DISPLAY CO., LTD., Gyeonggi-Do (KR)
Filed by Samsung Display Co., LTD., Yongin-si (KR)
Filed on Aug. 29, 2023, as Appl. No. 18/457,548.
Claims priority of application No. KR10-2022-0153956 (KR), filed on Nov. 16, 2022.
Prior Publication US 2024/0159515 A1, May 16, 2024
Int. Cl. G01B 11/02 (2006.01); G01B 11/06 (2006.01); G01B 11/03 (2006.01)
CPC G01B 11/06 (2013.01) [G01B 11/022 (2013.01); G01B 11/03 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A thickness measuring device comprising:
an imaging unit disposed above an inspection substrate, wherein the inspection substrate includes a substrate, a pattern provided on the substrate, and an inspection layer disposed on the pattern, wherein the imaging unit images the inspection substrate to output inspection image data; and
a data calculating unit connected to the imaging unit to receive the inspection image data and calculate a thickness value of the inspection layer from the inspection image data,
wherein the imaging unit is disposed to be inclined at a fixed angle with respect to the inspection substrate, and
wherein the data calculating unit calculates the thickness value of the inspection layer using a coordinate value of the pattern from the inspection image data.