US 12,405,101 B2
Hybrid wire localization length measurement device
Eoin Conor O'Farrell, Frederiksberg (DK); Roland Zeisel, Copenhagen (DK); Roman Mykolayovych Lutchyn, Santa Barbara, CA (US); Tom Marijn Laeven, Delft (NL); Kevin Alexander Van Hoogdalem, Alphen aan den Rijn (NL); Naganivetha Thiyagarajah, Copenhagen (DK); Andrey Antipov, Santa Barbara, CA (US); and William Scott Cole, Jr., Sammamish, WA (US)
Assigned to Microsoft Technology Licensing, LLC, Redmond, WA (US)
Filed by Microsoft Technology Licensing, LLC, Redmond, WA (US)
Filed on May 23, 2023, as Appl. No. 18/322,189.
Claims priority of provisional application 63/488,150, filed on Mar. 2, 2023.
Prior Publication US 2024/0295393 A1, Sep. 5, 2024
Int. Cl. G01B 7/02 (2006.01); G06N 10/40 (2022.01)
CPC G01B 7/02 (2013.01) [G06N 10/40 (2022.01)] 20 Claims
OG exemplary drawing
 
1. A superconductor-semiconductor device comprising:
a hybrid superconductor-semiconductor wire; and
a hybrid localization length (LL) measurement device including:
a plurality of contact gates located above the hybrid superconductor-semiconductor wire in a thickness direction; and
a conductance sensor electrically coupled to the plurality of contact gates.