US 12,405,065 B2
Cooling apparatus
Ryan Enright, Floral Park, NY (US); Raffaele Luca Amalfi, New Providence, NJ (US); and Stefano Grillanda, Springfield, NJ (US)
Assigned to Nokia Technologies Oy, Espoo (FI)
Filed by Nokia Technologies Oy, Espoo (FI)
Filed on Aug. 2, 2023, as Appl. No. 18/229,229.
Claims priority of application No. 22189786 (EP), filed on Aug. 10, 2022.
Prior Publication US 2024/0053108 A1, Feb. 15, 2024
Int. Cl. F28D 15/02 (2006.01); H05K 7/20 (2006.01); F21V 23/00 (2015.01)
CPC F28D 15/0241 (2013.01) [H05K 7/20336 (2013.01); F21V 23/003 (2013.01)] 14 Claims
OG exemplary drawing
 
1. An apparatus comprising:
a housing portion comprising one or more heat sources;
a flexible portion configured to be moved between a closed configuration and an open configuration wherein in the closed configuration the flexible portion is housed in the housing portion and in the open configuration the flexible portion is positioned outside of the housing; and
wherein the flexible portion comprises a flexible display and an oscillating heat pipe and the oscillating heat pipe is coupled to the one or more heat sources in the housing portion and the oscillating heat pipe is flexible and configured to move with the flexible portion between the closed configuration and the open configuration and wherein one or more condenser regions of the oscillating heat pipe are positioned in the flexible portion.