US 12,405,057 B2
Rapid spray drying system
Robert R. Andrews, Norfolk, MA (US); Herman E. Snyder, W. Lafayette, IN (US); William J. Merritt, Danvers, MA (US); Evan P. Ordway, Salem, MA (US); and Clair Strohl, Emmaus, PA (US)
Assigned to Velico Medical, Inc., Beverly, MA (US)
Filed by Velico Medical, Inc., Beverly, MA (US)
Filed on Jan. 13, 2024, as Appl. No. 18/412,479.
Application 18/412,479 is a continuation of application No. 18/096,645, filed on Jan. 13, 2023, granted, now 11,913,722.
Application 18/096,645 is a continuation of application No. 17/945,124, filed on Sep. 15, 2022, granted, now 11,841,189, issued on Dec. 12, 2023.
Prior Publication US 2024/0191943 A1, Jun. 13, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. F26B 3/12 (2006.01); A61K 35/16 (2015.01)
CPC F26B 3/12 (2013.01) [A61K 35/16 (2013.01)] 9 Claims
OG exemplary drawing
 
1. A method for spray drying plasma from an amount of a plasma from one or more donors using a spray drying disposable device having a spray drying head and a drying chamber,
the method comprises:
drying the amount of the plasma in a time period, wherein said drying step is performed with the spray drying disposable device comprising:
1) The spray drying head comprising:
1) A spray dry nozzle assembly in communication with a plasma source providing the amount of the plasma and a pressurized aerosol gas source providing a pressurized aerosol gas, wherein the pressurized aerosol gas flows in a vortex pattern configured to atomize the plasma entering the drying chamber to obtain atomized plasma droplets;
2) A drying gas inlet in communication with a drying gas source providing a drying gas;
2) The drying chamber, attached to the spray drying head, configured to evaporate the atomized plasma droplets into dried plasma particles with the drying gas emitted from the spray drying head and configured to capture the dried plasma particles and allow humid air to pass;
wherein the time period for drying the amount of plasma ranges from about 20 minutes to about 60 minutes.