US 12,404,967 B2
Stand, method of manufacturing stand, and keyboard-stand set
Tatsuya Hosokai, Yokohama (JP); and Hidehisa Mori, Yokohama (JP)
Assigned to LENOVO (SINGAPORE) PTE. LTD., Singapore (SG)
Filed by LENOVO (SINGAPORE) PTE. LTD., Singapore (SG)
Filed on Nov. 28, 2023, as Appl. No. 18/522,195.
Claims priority of application No. 2023-016985 (JP), filed on Feb. 7, 2023.
Prior Publication US 2024/0263733 A1, Aug. 8, 2024
Int. Cl. G06F 1/16 (2006.01); B29C 65/48 (2006.01); F16M 13/00 (2006.01); H05K 5/00 (2025.01); H05K 7/00 (2006.01); B29L 31/00 (2006.01)
CPC F16M 13/00 (2013.01) [B29C 65/486 (2013.01); B29L 2031/7502 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A stand that is configured to support an electronic apparatus in an erect state, the stand comprising:
a supporting portion having a supporting surface that is configured to support a rear surface of the electronic apparatus;
a leg portion rotatably connected to the supporting portion via a hinge;
a flexible member in a sheet shape, and that is along and protrudes from one edge of the supporting portion;
a surface material that is flexible and forms front surfaces of the supporting portion and of the flexible member;
a first bonding layer that fixes the surface material onto the supporting portion; and
a second bonding layer that has a lower coating density of a bonding adhesive than that of the first bonding layer and fixes the surface material onto the flexible member.