US 12,404,586 B2
Substrate rotating apparatus, processing system, and processing method
Noboru Uehara, Aichi (JP)
Assigned to SANTEC HOLDINGS CORPORATION, Aichi (JP)
Appl. No. 18/723,129
Filed by SANTEC HOLDINGS CORPORATION, Aichi (JP)
PCT Filed Jun. 23, 2023, PCT No. PCT/JP2023/023385
§ 371(c)(1), (2) Date Jun. 21, 2024,
PCT Pub. No. WO2024/262029, PCT Pub. Date Dec. 26, 2024.
Prior Publication US 2025/0116000 A1, Apr. 10, 2025
This patent is subject to a terminal disclaimer.
Int. Cl. C23C 16/458 (2006.01)
CPC C23C 16/4584 (2013.01) 11 Claims
OG exemplary drawing
 
1. A substrate rotating apparatus for film formation comprising:
a main rotation device including a rotation plate configured to rotate around a first rotation shaft, the rotation plate having a slit;
an auxiliary rotation device provided on the rotation plate and configured to revolve about the first rotation shaft as the rotation plate rotates; and
a guide rail provided around the first rotation shaft and configured to control a revolving motion of the auxiliary rotation device,
the guide rail having a contact surface extending in a circumferential direction with respect to the first rotation shaft,
the auxiliary rotation device comprising:
a second rotation shaft penetrating the slit of the rotation plate;
a rotating table for supporting a substrate as an object to be processed, the rotating table being arranged at a first end portion of the second rotation shaft; and
a wheel traveling on the contact surface, the wheel being arranged at a second end portion opposite to the first end portion of the second rotation shaft and coupled to the rotating table via the second rotation shaft,
the wheel and the rotating table rotating around the second rotation shaft while the wheel travels on the contact surface along with the revolving motion,
the slit of the rotation plate provided in a circumferential direction with respect to a third rotation shaft, the third rotation shaft being provided between the first rotation shaft and the second rotation shaft,
the second rotation shaft being displaced, along the slit, in a circumferential direction with respect to the third rotation shaft,
the guide rail controlling displacement of the second rotation shaft in the circumferential direction with respect to the third rotation shaft, and causing the auxiliary rotation device to perform the revolving motion in an orbit along the contact surface when the contact surface and the auxiliary rotation device are in contact with each other.