| CPC C23C 14/0617 (2013.01) [C23C 14/024 (2013.01); C23C 14/345 (2013.01); C23C 14/35 (2013.01); C23C 14/541 (2013.01); H10N 30/076 (2023.02); H10N 30/853 (2023.02)] | 8 Claims |

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1. A method of processing a substrate, comprising:
depositing a first piezoelectric material layer on the substrate in a first processing chamber by use of a physical vapor deposition process, wherein the first piezoelectric material layer is formed on the substrate while the substrate is at a first temperature, and a target used in the physical vapor deposition process comprises aluminum and scandium, wherein depositing the first piezoelectric material layer comprises:
establishing a distance between a surface of the target and a surface of the substrate, the distance being between about 30 mm and 70 mm;
maintaining a bias power between about 20 Watts (W) and about 50 W; and
maintaining a magnetic rotation speed between about 100 rpm and 150 rpm;
after depositing the first piezoelectric material layer, cooling the first piezoelectric material layer and the substrate in a second processing chamber; and
after cooling the first piezoelectric material layer and the substrate, depositing a second piezoelectric material layer on the first piezoelectric material layer at a second temperature, wherein:
the first piezoelectric material layer and the second piezoelectric material layer both comprise a first piezoelectric material, and
the first temperature is between 120° C. and 600° C., and the second temperature is less than or equal to 100° C.
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