	US 12,404,570 B2
	Diamond sintered material and tool including diamond sintered material
Hirotsugu Iwasaki, Hyogo (JP); Akihiko Ueda, Hyogo (JP); Michiko Matsukawa, Hyogo (JP); and Satoru Kukino, Osaka (JP)
Assigned to SUMITOMO ELECTRIC HARDMETAL CORP., Hyogo (JP); and Sumitomo Electric Industries, Ltd., Osaka (JP)
Appl. No. 17/912,492
Filed by SUMITOMO ELECTRIC HARDMETAL CORP., Hyogo (JP); and SUMITOMO ELECTRIC INDUSTRIES, LTD., Osaka (JP)
PCT Filed Oct. 22, 2020, PCT No. PCT/JP2020/039755 § 371(c)(1), (2) Date Sep. 17, 2022, PCT Pub. No. WO2022/085161, PCT Pub. Date Apr. 28, 2022.
Prior Publication US 2023/0203624 A1, Jun. 29, 2023
Int. Cl. C22C 26/00 (2006.01); B22F 1/12 (2022.01); B22F 3/10 (2006.01); B23B 27/14 (2006.01); C01B 32/25 (2017.01); C22C 1/05 (2023.01)

CPC C22C 26/00 (2013.01) [B22F 1/12 (2022.01); B22F 3/1017 (2013.01); B23B 27/148 (2013.01); C01B 32/25 (2017.08); C22C 1/05 (2013.01); B23B 2226/31 (2013.01); C01P 2002/60 (2013.01); C01P 2006/10 (2013.01)]

5 Claims

1. A diamond sintered material comprising diamond grains, wherein

a content ratio of the diamond grains is more than or equal to 80 volume % and less than or equal to 99 volume % with respect to the diamond sintered material,

an average grain size of the diamond grains is more than or equal to 0.1 μm and less than or equal to 50 μm, and

a dislocation density of the diamond grains is more than or equal to 1.2×10¹⁶m⁻²and less than or equal to 5.4×10¹⁹m⁻².